International Engineering Consortium
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IEC Announces 2008 DesignVision Award Finalists and Recognizes Best Design Tools and Products for New Year

Chicago – January 7, 2008 – The International Engineering Consortium (IEC) today honored the finalists of the 2008 DesignVision Awards by giving tribute to the best design tools and products in the semiconductor industry. The IEC's first official announcement of winners will take place at the DesignCon 2008 conference and exhibition this February 4-7 at the Santa Clara Convention Center in Santa Clara, CA.

"It's a pleasure to distinguish these innovators and top products for the design engineering community," commented IEC President John Janowiak. "We're grateful to all participants of this year's DesignVision Awards program for it's design teams and companies like these that are committed to the successful technology advancement that drive all industries forward."

Finalists were chosen from a record number of competing products by a panel of judges selected from the 2008 DesignCon Technical Program Committee, which contributed to the development of more than 120 sessions making up this year's educational program. This year's Technical Program Committee consists of 115 of the industry's top thought leaders.

In each of the eight categories, the 2008 award finalists include the following companies and products respectively:

ASIC and IC Design Tools

  • Cadence Design Systems, Inc. — Cadence Litho Electrical Analyzer
  • GiDEL Inc. — PROCStar II
  • Sequence Design — PowerTheater-Explorer

Design Verification Tools

  • EVE — Zebu-XXL
  • Mentor Graphics and Cadence Design Systems, Inc. — Open Verification Methodology
  • Synplicity, Inc — TotalRecall Full Visibility Technology

Interconnect Technologies and Components

  • Amphenol TCS — XCede
  • Cinch Connectors — Cinch iQ® Hybrid Interconnect
  • Sigrity, Inc. — OptimizePI

Semiconductors and ICs

  • Altera Corporation — Stratix III FPGA
  • Chip Estimate — ChipEstimate.com and IP Concierge
  • Gennum Corporation — 3 Gb/s Optical Module
  • Lattice Semiconductor — LatticeXP2 FPGA Family

Semiconductors and ICs (IP)

  • ARC International — ARC Video Subsystems
  • Rambus — The XDRTM Memory Architecture
  • Xilinx, Inc. — Xilinx® MOST® NIC LogiCORE™ IP Solution

Structured/Platform ASIC, FPGA, and PLD Design Tools

  • Altera Corporation — Quartus II v7.1 Software with Enhanced SOPC Builder
  • Lattice Semiconductor — LatticeXP2 FPGA Family
  • Xilinx — Integrated Software Environment (ISEâ,,˘) 9.1i

System-Level Design Tools

  • Carbon Design Systems — Carbon Model Studio
  • FuturePlus Systems, Corp. — FS5000 Jitterlyzer
  • Synplicity, Inc. — Synplify DSP ASIC Edition

Test and Measurement Equipment

  • Agilent Technologies — Agilent N6705A DC Power Analyzer
  • ASA Corp. — M1 Oscilloscope Tools v5
  • SyntheSys Research, Inc. — BERTScope Phase Locked Loop Analyzer

The first official announcement of winners will take place at the 2008 DesignVision Awards Ceremony at DesignCon 2008 on Tuesday, February 5, 2008, at noon in the theater of the Santa Clara Convention Center. Entrance to the awards ceremony is complimentary with an Exhibits Plus Pass available at www.designcon.com/2008/register/index.asp

Visit www.designcon.com/2008/ for full information or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.

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About DesignCon 2008
Now in its twelfth year, the DesignCon 2008 conference and exhibition will present more than 300 experts in its world-class educational program and 130 exhibitors on its cutting-edge exhibition floor this February 4-7, 2008 at the Santa Clara Convention Center in Santa Clara, CA. More than 120 premier educational sessions will complement five pavilions including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, the Verification Technology Pavilion and the University Pavilion. The DesignVision Awards and DesignCon Paper Awards also take place at the event giving tribute to outstanding contributions to the industry. Co-located events include meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum will also feature panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which developed this year's educational conference. For complete information, visit www.designcon.com/2008/

ABOUT THE IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.

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