International Engineering Consortium
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IEC Houses Ethernet Alliance Open Meeting and More at DesignCon 2007 in Santa Clara

Contact: Lisa Reyes
Phone: +1-312-559-3325
E-Mail: lreyes@iec.org

The Ethernet Alliance Shares the Latest in 10 Gb Ethernet, Optical and Copper Interconnects, Standards, Tradeoffs, Business Choices, PoEPlus, Energy-Efficient Ethernet and More at DesignCon 2007

CHICAGO – Jan. 18, 2007 – The International Engineering Consortium (IEC) welcomes the Ethernet Alliance and its members at DesignCon 2007, which takes place this January 29 through February 1 at the Santa Clara Convention Center in Santa Clara, California.

IEC President John Janowiak commented, "Having the Ethernet Alliance present at DesignCon as well as their Open Meeting as a co-located event brings tremendous value to our educational programming. We are delighted to help host Ethernet Alliance members as well to introduce this well-respected association to attendees and potential new members."

Technology expert speakers from the Ethernet Alliance will discuss the latest Ethernet advancements allowing delegates to gain the latest update of the most current information regarding design engineering theory, technique and practical strategies.

Ethernet Alliance President Brad Booth also commented, "We are proud to announce that since our official launch in January 2006, Ethernet Alliance membership has grown over 300 percent. At DesignCon, we look forward to informing potential new members of the benefits and opportunities that are available to them as Ethernet Alliance members."

"The Ethernet Alliance is pleased to be an associate sponsor at DesignCon 2007," Booth said.

Ethernet Alliance speakers include Bill Woodruff of Aquantia, who will give a discussion on 10GBASE-T basics; Daniel Feldman of Microsemi, who will share the latest in PoEPlus; and Mike Bennett of Lawrence Berkeley Labs, who will present cutting-edge information on energy-efficient Ethernet.

The Ethernet Alliance Open Meeting will take place Wednesday, January 31 at 1 p.m. at DesignCon 2007.

As part of the DesignCon conference programming, the Ethernet Alliance will also present a Tech Forum Tutorial Session titled 10 Gb Ethernet: Optical and Copper Interconnects, Standards, Tradeoffs, and Business Choices on Monday, January 29 at 1:30 p.m.

Industry experts leading the discussion include Bruce Tolley and George Zimmerman of Solarflare Communications and Scott Schub of Intel.

DesignCon's full conference schedule is available at www.designcon.com/2007/conference/schedule.html.

For complete information, visit www.designcon.com/2007 or contact Lisa Reyes at lreyes@iec.org or +1-312-559-3325.

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About DesignCon
DesignCon serves as the premier event for practicing engineers in the electrical design and semiconductor communities. Broadening the scope to address business as well as technical issues of the industry, DesignCon 2006 hosted 125 exhibiting companies and drew more than 5,000 industry professionals to register. This year's DesignCon will host more than 300 industry experts to speak in more than 100 educational tutorials, plenary panels, paper presentations, and sessions at DesignCon. Complementing the conference, more than 125 exhibitors are expected to take the floor exhibiting the latest technological developments. Visit www.designcon.com/2007.

About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. The IEC also manages the activities of the Enterprise Communications Consortium. Visit www.iec.org.

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