IEC Opens Latin American Broadband Gateway and Brings Broadband World Forum Americas to São Paulo this December

U.S. Contact: Lisa Reyes
Phone: +1-312-559-3325
E-Mail: lreyes@iec.org

Chicago – August 28, 2007 – The International Engineering Consortium (IEC) takes its world-renowned Broadband World Forum to São Paulo, Brazil from 3–6 December with Telefónica serving as the official host sponsor. The Broadband World Forum Americas 2007 conference and exhibition will bring industry pioneers, leading experts, and key vendors together at the ITM Expo to discuss the latest in broadband technologies.

"With the established success the Broadband World Forum has demonstrated throughout Europe and Asia, we felt an industry need to bring the same world-class educational content and cutting-edge exhibition to Latin and South America and help open the 'Latin American Broadband Gateway' to the world," commented IEC President John Janowiak.

IEC President John Janowiak excitedly explains the success of the Broadband World Forum throughout Europe and Asia and invites the South American telecom executives to participate in the first World Forum in Latin and South America.

Mr. Carlos Alberto Morales Paulin, vice president for residential business at Telefónica further commented at the event launch, "Telefonica is pleased to be part of this important broadband event. In the past ten years, industry innovation has opened new doors around the world and the future shows us explosive opportunities here too. That's one of the reasons Telefónica is proud to be the official host sponsor of the IEC's Broadband World Forum Americas."

Mr. Morales addresses senior-level executives at the event launch and shares why Telefonica chose to partner with the IEC in hosting the upcoming BBWF Americas.

The upcoming Broadband World Forum Americas will join incumbent telcos, wireless operators, cable companies, ISPs, CLECs, ASPs, and various enterprises together to network, learn from one another, and examine the applications, services, and content that drive broadband demand. Attendees will also take a first-hand look at network solutions and technologies key to the region.

World Chair Antonio Carlos Valente, president of Telefónica Group, will keynote the event along with Mr. Jose Pallete, president of Telefónica International. Other key industry leaders who will serve as speakers at the Broadband World Forum Americas include Mr. Carlos Barroso, chief technology and operations officer of Neovia Telecom; Mr. Vera Buzanello, senior vice president of distribution at Discovery Networks Latin America; Mr. Aluizio Byrro, vice president and senior executive at Nokia Siemens Networks; Mr. Ricardo Distler, partner at Accenture; Mr. Mauro Fukuda, technology director at Brasil Telecom; Mr. Alvaro Gazzolo, president and chief executive officer of IPTV Americas; Ms. Kay Johansson, chief technology officer of MobiTV, Inc.; Ms. Leila Loria, general manager of TVA; Mr. Fernando Madeira, chief executive officer of Terra Networks; Mr. Roberto Medeiros, president of Telefonica Empresas; Ms. Sandra Pecis, vice president of product and content at Terra Networks; and Mr. Antonio Parrini Pimenta, network director at Oi.

Key industry players who will showcase their latest advancements on the exhibition floor of the Broadband World Forum Americas include Official Host Sponsor Telefónica; Nokia Siemens Networks; Alcatel-Lucent; Juniper Networks; the DSL Forum; Ecocarrier; Enure Networks; Kendra Initiative; KEYMILE; Motorola; Optelian; Redline Communications; Sandvine; Vecima Networks and more.

Telefonica executives Mr. Roberto Medeiros and Mr. Carlos Alberto Morales Paulin join IEC President John Janowiak at the IEC event launch last week in hosting key players of the region.

To sponsor or exhibit at the event, contact Cliff Ruffin at +1-312-559-3301 or Christine Paplaczyk at +1-312-559-4616.

Speaking opportunities are also still available at: www.iec.org/events/2007/bbwf_americas/conference/call_for_speaker_proposals.html.

For full information, visit www.iec.org/events/2007/bbwf_americas/ or contact Lisa Reyes at +1-312-559-3325 or lreyes@iec.org.

ABOUT THE IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.